SUSTech four-dual-rail-qubit processor
Southern University of Science and Technology (Huang et al.)
SUSTech four-dual-rail-qubit processor
Register profile — the machine's variant of its architecture
qubit type: dual rail from pairs of tunable transmons (millisecond coherence in the logical subspace)
gate mechanism: tunable couplers between logical qubits: coupler-activated XX interaction gives a logical √iSWAP, from which a logical CNOT is synthesised
connectivity: logical qubits coupled pairwise through tunable couplers
control: room-temperature DACs (2 GS/s) and ADCs (1 GS/s); chip at 10 mK in a dilution refrigerator
control placement: room-temp
readout: mid-circuit erasure check per dual rail by an ancilla (conditional π pulse resonant only on |00⟩); erasures post-selected
gate evidence: no published figure
codes: dual_rail
flags: post-selection dominates the result
Technologies by layer — the machine's cell per layer
| 1 Qubit carrier | |
| 2 Encoding | Dual-rail (erasure) encoding · primary ▤ Abstract ✅ dual-rail encoding in pairs of tunable transmons; millisecond-scale coherence, logical 1Q gate error ~1e-5 with erasure post-selection |
| 3 Gate mechanism | Tunable-coupler CZ / iSWAP · primary ▤ §IV (coupler-induced XX coupling, √iSWAP, CNOT); Fig. 4a ✅ tuning the coupler induces an XX coupling in the logical subspace: logical √iSWAP, then a logical CNOT (98.1% at a 13% erasure rate in the Nature Physics version; 96.2% in arXiv v1) |
| 4 Connectivity / transport | Static nearest-neighbour lattice · primary ▣ §II, Fig. 1b ✅ four logical qubits tunably coupled to each other through couplers C_ij |
| 5 Control | Room-temperature electronics + per-qubit coax/flex · primary ▤ Supplementary §I (measurement setup) ✅ room-temperature DACs (2 GS/s) and ADCs (1 GS/s); chip at 10 mK in a dilution refrigerator |
| 6 Readout | Mid-circuit erasure check · primary ▣ §III; Fig. 2a (erasure check) ✅ an ancilla per dual rail detects leakage to |00⟩ mid-circuit (conditional π pulse); erasures post-selected |
| 7 Code | Erasure-adapted codes · primary ▤ 🔎 dual-rail erasure qubits as the route to erasure-adapted QEC; no code run beyond the encoding (L1) |
| 8 Decoder | — none — nothing in this layer ▤ Abstract ('by using post-selection to mitigate erasure errors') ✅ no decoder; erasure errors handled by post-selection |
| 9 Interconnect | Multi-die packaging in one module (flip-chip, bump-bonded control die) · primary ▣ §II, Fig. 1a; Supplementary §I ✅ flip-chip processor: top qubit chip on a bottom carrier chip (non-galvanic flip-chip assembly) |
| 10 Manufacturing | Superconducting-qubit lithography (Al/AlOx/Al junctions, Nb wiring, 300 mm) · primary ▣ Fig. 1a; Supplementary §I ✅ superconducting flip-chip processor (qubit chip + carrier chip) |
evidence: ✅ 9 / 10