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SUSTech four-dual-rail-qubit processor

Southern University of Science and Technology (Huang et al.)

SUSTech four-dual-rail-qubit processor

Southern University of Science and Technology (Huang et al.) · superconducting circuits · DEMONSTRATED (Nature Physics, 6 Mar 2026; arXiv 16 Apr 2025) (6 Mar 2026 (Nature Physics; arXiv 16 Apr 2025)) · 8 physical qubits · access: lab-only

Register profile — the machine's variant of its architecture

qubit type: dual rail from pairs of tunable transmons (millisecond coherence in the logical subspace)
gate mechanism: tunable couplers between logical qubits: coupler-activated XX interaction gives a logical √iSWAP, from which a logical CNOT is synthesised
connectivity: logical qubits coupled pairwise through tunable couplers
control: room-temperature DACs (2 GS/s) and ADCs (1 GS/s); chip at 10 mK in a dilution refrigerator
control placement: room-temp
readout: mid-circuit erasure check per dual rail by an ancilla (conditional π pulse resonant only on |00⟩); erasures post-selected
gate evidence: no published figure
codes: dual_rail
flags: post-selection dominates the result

Technologies by layer — the machine's cell per layer

1 Qubit carrier
Transmon · primary ▣ §II, Fig. 1b (logical qubit = transmons Q_iA, Q_iB + ancilla A_i) ✅
each dual-rail qubit is a pair of tunable transmons, with an ancilla transmon for erasure checks
2 Encoding
Dual-rail (erasure) encoding · primary ▤ Abstract ✅
dual-rail encoding in pairs of tunable transmons; millisecond-scale coherence, logical 1Q gate error ~1e-5 with erasure post-selection
3 Gate mechanism
Tunable-coupler CZ / iSWAP · primary ▤ §IV (coupler-induced XX coupling, √iSWAP, CNOT); Fig. 4a ✅
tuning the coupler induces an XX coupling in the logical subspace: logical √iSWAP, then a logical CNOT (98.1% at a 13% erasure rate in the Nature Physics version; 96.2% in arXiv v1)
4 Connectivity / transport
Static nearest-neighbour lattice · primary ▣ §II, Fig. 1b ✅
four logical qubits tunably coupled to each other through couplers C_ij
5 Control
Room-temperature electronics + per-qubit coax/flex · primary ▤ Supplementary §I (measurement setup) ✅
room-temperature DACs (2 GS/s) and ADCs (1 GS/s); chip at 10 mK in a dilution refrigerator
6 Readout
Mid-circuit erasure check · primary ▣ §III; Fig. 2a (erasure check) ✅
an ancilla per dual rail detects leakage to |00⟩ mid-circuit (conditional π pulse); erasures post-selected
7 Code
Erasure-adapted codes · primary ▤ 🔎
dual-rail erasure qubits as the route to erasure-adapted QEC; no code run beyond the encoding (L1)
8 Decoder
— none — nothing in this layer ▤ Abstract ('by using post-selection to mitigate erasure errors') ✅
no decoder; erasure errors handled by post-selection
9 Interconnect
Multi-die packaging in one module (flip-chip, bump-bonded control die) · primary ▣ §II, Fig. 1a; Supplementary §I ✅
flip-chip processor: top qubit chip on a bottom carrier chip (non-galvanic flip-chip assembly)
10 Manufacturing
Superconducting-qubit lithography (Al/AlOx/Al junctions, Nb wiring, 300 mm) · primary ▣ Fig. 1a; Supplementary §I ✅
superconducting flip-chip processor (qubit chip + carrier chip)
evidence: ✅ 9 / 10