iQPU / UQConnect

Raveh Neeman

doi:10.5281/zenodo.22674814

Universal Quantum · trapped ions · DEMONSTRATED (two-module machine) (2023-2026) · 64 physical qubits · access: lab; DLR contract milestones due end-2026

architecture: Trapped ions — QCCD (transport between zones) · Open on the map

Register profile — the machine's variant of its architecture

qubit type: hyperfine qubit

gate mechanism: microwave fields coupled through a static magnetic-field gradient, no per-qubit lasers

connectivity: QCCD within a module; UQConnect transfers ions between separate trap modules at 2,424 transfers per second with qubit-loss infidelity below 7e-8

control: chip-integrated microwave; UQLogic and UQConnect delivered as commercial ASICs

control placement: on-chip microwave

readout: fluorescence

gate evidence: no published figure

flags: conflicting qubit counts, no published error rates

Technologies by layer — the machine's cell per layer

1 Qubit carrier	Trapped atomic ion · primary ▣ Fig. 3 (the ion-trap microchip modules); §Experimental set-up ✅ hyperfine ion qubits; 'hundreds of ion qubits per large die (>400 mm²)', no benchmarked register size (a 2026 secondary source says 64-qubit QCCD)
2 Encoding	Hyperfine / clock-state qubit · primary ▤ §Preserving qubit coherence (qubit in the S1/2 hyperfine manifold of 171Yb+) ✅ hyperfine qubit (family-determined)
3 Gate mechanism	Electronic microwave gate (ions, laser-free: near-field or static gradient) · primary ▨ ✅ microwave fields coupled through a static magnetic-field gradient, no per-qubit lasers
4 Connectivity / transport	Ion shuttling (QCCD, junctions, grid traps) · primary ▣ Fig. 2 (section of a modular QCCD architecture); §Inter-module ion transport ✅ QCCD ion transport within a module; UQConnect ion transfer between trap modules, 2,424 transfers/s, qubit-loss infidelity <7e-8 (2026)
5 Control	Chip-integrated microwave control (ions) · primary ▨ 🔎 chip-integrated on-chip microwave control; UQLogic and UQConnect delivered as commercial ASICs
6 Readout	Fluorescence state detection (ions, defects) · primary ◌ 🔎 fluorescence (family-determined)
7 Code	— none — nothing in this layer ▨ 🔎 no QEC code run; none
8 Decoder	— none — nothing in this layer ▨ 🔎 no decoder; none
9 Interconnect	— (Atlas gap: ∅G-ionmatter) · primary ▣ Fig. 1 (connecting Module A and Module B); §Inter-module ion transport; Methods: DC ion transfer protocol ✅ chip-to-chip matter link: UQConnect physically transfers ions between trap modules, 2,424 transfers/s, loss infidelity <7e-8; not photonic
10 Manufacturing	Ion-trap fabrication (surface-electrode chips; machined 3D blade traps) · primary ▨ 🔎 microchip traps fabricated on a commercial 200 mm foundry line (secondary source) 300 mm CMOS foundry (spins, cryo-CMOS, superconducting wiring) · alternate ▨ 🔎 CMOS-foundry manufacture of trap modules claimed

Standard records

code rate k/n → 2420 transfers/s · best (inter-module ion transfer)

qubit-loss infidelity below 7e-8 per transfer · 2026 · source

device yield → 1 · best (qubit-loss infidelity 7e-8 per inter-module transfer)

2026 · source

evidence: ✅ 5 / 11