Qolab devices at the IQCC

Raveh Neeman

doi:10.5281/zenodo.22674814

Qolab · superconducting circuits · DEPLOYED (component level) (Dec 2025) · qubits not published · access: cloud via the IQCC

architecture: Transmon lattice with tunable couplers · Open on the map

Register profile — the machine's variant of its architecture

qubit type: transmon

gate mechanism: tunable coupler

connectivity: not published

control: room-temperature RF

control placement: room-temp

readout: dispersive

gate evidence: no published figure

flags: no published error rates, source not confirmed

Technologies by layer — the machine's cell per layer

1 Qubit carrier	Transmon · primary ▦ §Component integration (140 mm x 140 mm qubit die, up to 20,000 qubits); §Window-junction process 🔎 transmon; qubit count not disclosed; devices installed at IQCC Tel Aviv Dec 2025, Madison devices via IQCC cloud
2 Encoding	Bare physical qubit (no encoding) · primary ◌ 🔎 Bare two-level subspace — Computational subspace of an anharmonic oscillator; leakage to \|2⟩ is the price.
3 Gate mechanism	Tunable-coupler CZ / iSWAP · primary ▨ 🔎 tunable coupler (register); no fidelities published
4 Connectivity / transport	Static nearest-neighbour lattice · primary ▨ 🔎 connectivity not published (register)
5 Control	Room-temperature electronics + per-qubit coax/flex · primary ▦ §Core Capabilities (direct access to microwave and flux pulses; packaging, wiring, filtering, shielding) 🔎 room-temperature RF (register)
6 Readout	Dispersive microwave readout (+TWPA, Purcell) · primary ▦ §Cryogenic integrated circuits (Josephson photomultipliers + SQUID amplifiers replace TWPAs and circulators) 🔎 dispersive readout (register)
7 Code	— none — nothing in this layer ▨ 🔎 no QEC code (L0); no fidelities or coherence published
8 Decoder	— none — nothing in this layer ▨ 🔎 no decoder; no real-time path (register)
9 Interconnect	— none — nothing in this layer ▦ §Component integration (qubit + wiring wafers bonded into a tiling module, capacitively coupled to neighbours) 🔎 monolithic, single module; no interconnect
10 Manufacturing	Superconducting-qubit lithography (Al/AlOx/Al junctions, Nb wiring, 300 mm) · primary ▦ §Window-junction process; SEM figure (a) tilted-angle SEM of the window junction, (b) magnified junction ✅ superconducting fab focus: repeatability, flux-noise reduction, manufacturability 300 mm CMOS foundry (spins, cryo-CMOS, superconducting wiring) · alternate ▦ §Window-junction process (semiconductor-compatible; scales to 300 mm wafers) ✅ manufacturability with advanced semiconductor processes (claimed)

evidence: ✅ 2 / 11