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QpiAI Kaveri

QpiAI

QpiAI Kaveri

QpiAI · superconducting circuits · ANNOUNCED (64-qubit chip unveiled 3-4 Nov 2025; commercial availability promised by Q3 2026, not confirmed by 26 Sep 2026; the Mar-2026 decoder result was validated on simulated qubits) (3 Nov 2025) · 64 physical qubits · access: research use

Register profile — the machine's variant of its architecture

qubit type: transmon in a grid layout
gate mechanism: tunable coupler (assumed); wafer-scale fabrication and flip-chip integration
connectivity: grid
control: room-temperature RF
control placement: room-temp
readout: dispersive
gate evidence: a published figure (source class not yet tagged)
flags: aggregate error only

Technologies by layer — the machine's cell per layer

1 Qubit carrier
Transmon · primary ▨ ✅
64 transmons in a grid layout; coherence ≈100 µs (best/median not stated), Feb 2026
2 Encoding
Bare physical qubit (no encoding) · primary ◌ 🔎
Bare two-level subspace — Computational subspace of an anharmonic oscillator; leakage to |2⟩ is the price.
3 Gate mechanism
Tunable-coupler CZ / iSWAP · primary ▨ 🔎
tunable coupler (assumed); error rates ≈10⁻² with no 1Q / 2Q / readout breakdown (Feb 2026)
4 Connectivity / transport
Static nearest-neighbour lattice · primary ▨ 🔎
grid layout, degree 4 (register); 64 qubits
5 Control
Room-temperature electronics + per-qubit coax/flex · primary ▨ 🔎
room-temperature RF (register); control circuitry separated from qubit plane by low-loss interconnect layers
6 Readout
Dispersive microwave readout (+TWPA, Purcell) · primary ◌ 🔎
dispersive readout (register)
7 Code
— none — nothing in this layer ▨ 🔎
no QEC code (L0); explicitly NISQ, announced 26 Feb 2026
8 Decoder
— none — nothing in this layer ▨ 🔎
no decoder; no real-time path (register)
9 Interconnect
Multi-die packaging in one module (flip-chip, bump-bonded control die) · primary ▨ 🔎
flip-chip integration: low-loss interconnect layers separate qubit plane from control circuitry inside one module
10 Manufacturing
Superconducting-qubit lithography (Al/AlOx/Al junctions, Nb wiring, 300 mm) · primary ▨ 🔎
wafer-scale fabrication and flip-chip integration; fabricated in India with some imported components

Standard records

T1 relaxation → 100 µs · scope unstated (best or median not distinguished)
Feb 2026 · source
evidence: ✅ 1 / 10