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Fujitsu 1,000-qubit machine

Fujitsu (+ RIKEN)

Fujitsu 1,000-qubit machine

Fujitsu (+ RIKEN) · superconducting circuits · PLANNED (no launch found) (2026 target) · 1000 physical qubits · access: n/a

Register profile — the machine's variant of its architecture

qubit type: transmon
gate mechanism: not published
connectivity: 4-qubit unit cell + 3-D wiring, ~250 cells
control: 4-qubit unit cells arranged in a 3-D configuration (64/256-qubit RIKEN–Fujitsu lineage); wiring of the 1,000-qubit machine not published
control placement: room-temp
readout: dispersive
gate evidence: no published figure
flags: no published error rates, schedule risk, source not confirmed

Technologies by layer — the machine's cell per layer

1 Qubit carrier
Transmon · primary ▨ closing paragraph (1,000-qubit plan) 🔎
superconducting 1,000-qubit computer scheduled to be installed in 2026 (qubit type not named in the release)
2 Encoding
Bare physical qubit (no encoding) · primary ◌ 🔎
bare transmon two-level subspace; no encoding beyond the physical qubit
3 Gate mechanism
Tunable-coupler CZ / iSWAP · alternate ▨ 🔎
tunable-coupler gate not confirmed; Fujitsu gate mechanism not published
— undisclosed — exists, nothing published ▨ 🔎
gate mechanism not published; no specifications or fidelity targets published
4 Connectivity / transport
Static nearest-neighbour lattice · primary ▨ 🔎
expected 4-qubit unit cell + 3-D wiring repeated ≈250 cells; some coverage frames target as 1,024 qubits
5 Control
Vertical (out-of-plane) signal delivery — VIO, coaxmon, 3D wiring · primary ▨ release 22 Apr 2025 (3D unit-cell configuration; 1,000-qubit plan) 🔎
lineage: 256-qubit machine arranges 4-qubit unit cells in a 3-D configuration with quadrupled implementation density; 1,000-qubit computer scheduled for installation at Fujitsu Technology Park in 2026; its wiring not published
Room-temperature electronics + per-qubit coax/flex · alternate ▨ 🔎
room-temperature control with perpendicular wiring (register)
6 Readout
Dispersive microwave readout (+TWPA, Purcell) · primary ◌ 🔎
dispersive readout
7 Code
— none — nothing in this layer ▨ 🔎
no QEC code; planned device with no specifications published
8 Decoder
— none — nothing in this layer ▨ 🔎
no decoder; planned device with no specifications published
9 Interconnect
— none — nothing in this layer ◌ 🔎
monolithic, single module assumed; no interconnect details published
10 Manufacturing
Superconducting-qubit lithography (Al/AlOx/Al junctions, Nb wiring, 300 mm) · primary ◌ 🔎
Superconducting-qubit lithography (Nb/Al JJ, 300 mm) — IBM Albany 300 mm / Anderon foundry; Google Santa Barbara; Rigetti ABAA trimming (97.4% frequency-targeting success); OQC 500-qubit wafer-scale…
evidence: ✅ 0 / 12