Tianyan-287
China Telecom Quantum Group / QuantumCTek / CAS
Tianyan-287
Register profile — the machine's variant of its architecture
qubit type: tunable transmon
gate mechanism: tunable coupler; explicitly a Zuchongzhi 3.0-like architecture; iSWAP-like (fSim) two-qubit gate at a fixed 40 ns, single-qubit gates 26 ns with DRAG (arXiv:2512.10504); the cloud's native gate set in the owner SDK: RZ, X2P, X2M, Y2P, Y2M, XY2P, XY2M, CZ (cqlib-tianyan device_config.rs, Sep 2026); the AshN scheme (simultaneous XY drives on both qubits with the tunable coupler) gives a native set of CZ 48 ns, iSWAP 44 ns, √iSWAP 28 ns, SWAP 60 ns and a B-like gate 44 ns on the 105-qubit, 182-coupler device of arXiv:2608.24084 (CTQG with Tsinghua, Aug 2026; the paper names the architecture, not the machine)
connectivity: square grid lattice, 105 qubits and 182 couplers (the owner's wording, arXiv:2512.10504)
control: room-temperature RF; per-qubit XY and Z lines combined at room temperature through a bias tee before the refrigerator, coupler lines routed separately (arXiv:2608.24084)
control placement: room-temp
readout: dispersive; X12-gate-driven 0–2 readout, correlated readout errors below 2 % with a synchronous SPAM protocol (arXiv:2512.10504); a TWPA at the mixing-chamber stage and a HEMT at 4 K (arXiv:2608.24084)
gate evidence: a number stated by the vendor, protocol unstated
flags: estimated baseline, the name is not a qubit count
Technologies by layer — the machine's cell per layer
| 1 Qubit carrier | |
| 2 Encoding | Bare physical qubit (no encoding) · primary ◌ 🔎 bare transmon |0⟩/|1⟩ subspace; family-determined, no machine-specific source |
| 3 Gate mechanism | Tunable-coupler CZ / iSWAP · primary ▣ Fig. 2b (iSWAP-like gate patterns A-D on couplers); Fig. 1b (e1/e2 heat map) ✅ tunable-coupler gates, Zuchongzhi 3.0-like design; 1Q 99.90 %, 2Q 99.56 %; parallel 2Q error 4.4e-3 (Dec 2025) |
| 4 Connectivity / transport | Static nearest-neighbour lattice · primary ▣ Fig. 1b (qubit/coupler layout); Fig. 2b (74-qubit pattern; inset topology) ✅ rectangular lattice, 105 qubits with 182 couplers (Zuchongzhi 3.0-like) |
| 5 Control | Room-temperature electronics + per-qubit coax/flex · primary ▤ 🔎 room-temperature RF control (register); no control-stack detail in note |
| 6 Readout | Dispersive microwave readout (+TWPA, Purcell) · primary ▣ Fig. 2a (readout error CDF, mean 1.3%); Fig. 1c (daily readout error e3) ✅ dispersive readout; readout fidelity 98.7 % (SPAM error 1.3e-2, typical) |
| 7 Code | — none — nothing in this layer ▣ Fig. 2c (74-qubit RCS fidelity; no QEC experiment) ✅ no QEC published; NISQ device (RCS demonstration) |
| 8 Decoder | |
| 9 Interconnect | Multi-die packaging in one module (flip-chip, bump-bonded control die) · primary ▤ 🔎 multi-die packaging inside one qubit module (technology per note; no packaging detail given) |
| 10 Manufacturing | Superconducting-qubit lithography (Al/AlOx/Al junctions, Nb wiring, 300 mm) · primary ◌ 🔎 superconducting-qubit lithography; family-determined, no machine-specific fab source |
Standard records
2Q error under full-width parallel operation → 4.40e-3 · typical
Dec 2025 · source
SPAM error → 0.013 · typical
Dec 2025 · source
evidence: ✅ 5 / 10