← Quantum Technology AtlasTechnologies · Machines · Architectures · OrganisationsРусскийעברית

Tianyan-176 / Tianyan-176 II (and Tianyan-24 sibling)

China Telecom Quantum Group + QuantumCTek

Tianyan-176 / Tianyan-176 II (and Tianyan-24 sibling)

China Telecom Quantum Group + QuantumCTek · superconducting circuits · DEPLOYED (2023) · 66 physical qubits · access: cloud service (the Tianyan cloud through the Cqlib SDK, backends 'tianyan176' and 'tianyan176-2')

Register profile — the machine's variant of its architecture

qubit type: transmon
gate mechanism: coupler type not published; the cloud's native gate set in the owner SDK for tianyan176 and tianyan176-2: RZ, X2P, X2M, Y2P, Y2M, XY2P, XY2M, CZ (cqlib-tianyan device_config.rs, Sep 2026)
connectivity: a two-dimensional array of 66 qubits with 110 tunable couplers, as third-party users describe the processor (arXiv:2609.32433, Sep 2026); the coupler map (Q0–Q65, G0–G109) is served to users by the SDK's download_config (owner tutorial, Aug 2024)
control: room-temperature RF
control placement: room-temp
readout: dispersive
gate evidence: a number stated by the vendor, protocol unstated
flags: the name is not a qubit count, company claim

Technologies by layer — the machine's cell per layer

1 Qubit carrier
Transmon · primary ▤ §II Tianyan high-performance quantum cloud services; Fig. 1a ✅
176 transmons (plus 24-q sibling), CTQG/QuantumCTek Tianyan cloud, deployed 2023
2 Encoding
Bare physical qubit (no encoding) · primary ◌ 🔎
bare transmon |0⟩/|1⟩ subspace; family-determined, no machine-specific source
3 Gate mechanism
Tunable-coupler CZ / iSWAP · primary ▤ §II Tianyan high-performance quantum cloud services 🔎
coupler type not published (g_tc assumed); quoted 1Q 99.9 % / 2Q 99.6 % (press figure, no paper)
4 Connectivity / transport
Static nearest-neighbour lattice · primary ▤ §II Tianyan high-performance quantum cloud services 🔎
topology not published
5 Control
Room-temperature electronics + per-qubit coax/flex · primary ▨ 🔎
room-temperature RF control (register); no control-stack detail published
6 Readout
Dispersive microwave readout (+TWPA, Purcell) · primary ◌ 🔎
dispersive readout (family-determined); no readout fidelity published
7 Code
— none — nothing in this layer ▨ 🔎
no QEC code; NISQ cloud device
8 Decoder
— none — nothing in this layer ▨ 🔎
no decoder; no QEC run
9 Interconnect
— none — nothing in this layer ◌ 🔎
monolithic single chip, no interconnect
10 Manufacturing
Superconducting-qubit lithography (Al/AlOx/Al junctions, Nb wiring, 300 mm) · primary ◌ 🔎
superconducting-qubit lithography; family-determined, no machine-specific fab source
evidence: ✅ 1 / 10