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Fibre links between photonic modules ic_fibre

Telecom fibre carrying heralded entanglement between photonic chips and racks — priced per connector, not per metre, and with no published rate.

Fibre links between photonic modules

ic_fibre · layer 9 Interconnect · demonstrated · since 2025

Chip-to-chip Bell 99.72% over 42 m (loss excluded); Aurora inter-rack fibre.

Brief →

Key references

[169] K. Alexander et al., “A manufacturable platform for photonic quantum computing,” Nature, v… · 2025
[173] H. A. Rad et al., “Scaling and networking a modular photonic quantum computer,” Nature, vo… · 2025
[172] Xanadu, “Xanadu sets new industry benchmark in photonic chip packaging,” PR Newswire, Jun.… · 2026

Design space — attributes

(a) carrier affinity
photon (natural particle, engineered modes)
(b) time · entangling
—
(c) readout
—
(d) mobility
flying qubits (photons)
(e) control
electro-optic @ room temperature
(f) error structure
loss (erasure)
(g) manufacturing
photonic IC foundry

Evaluation space — dated attributes

chip-to-chip Bell fidelity → 99.72% over 42 m, conditional on heralded events (channel loss excluded)
defines: error channel · 2025-02 · source

Facet coupling is quoted on two different bases: Xanadu 0.085 dB/facet [C] against PsiQuantum's published 52(12) mdB [D] for the same interface.

Actors & goals — annotations

Edges

needs: Photonic IC foundry (SiN, BTO, TFLN, SNSPD on 300 mm)
° one of several that would do · the usual route, not a strict need

Used by 4 machines (2 primary · 2 alternate)

↗ its register card · paper / product / press: links that name the machine (attribution checked on 20 Sep 2026)

Pictures

Every picture carries the story of what it shows and its credit line.

File:Optical fiber connectors-optical patch cable-01ASD.jpg
A photograph of an ordinary duplex single-mode fibre patch cable, yellow jackets and blue SC connectors with protective caps, still in its bag with a test card listing insertion and return loss. It was taken by Asurnipal (2019-12-03); the description links it to a fibre-optic splice at the Feldkircher Hut in Vorarlberg, Austria, for the drinking-water supply. This is standard telecom equipment, not quantum hardware, but the same fibres and connectors link photonic modules, where every decibel of loss costs fragile single photons. “Optical fiber connectors-optical patch cable-01ASD” by Asurnipal, commons.wikimedia.org/wiki/File:Optical_fiber_connectors-opt…, CC BY SA 4.0 (creativecommons.org/licenses/by-sa/4.0/)
Fig. 1 — Fig. 1a Scenario of a star-topology quantum network. b Functions of the photonic quantum teleportation involving the user node, relay node, and cent…
Six-panel figure. (a) A star-shaped quantum network with user nodes (red), relay nodes (green) and a central node (blue) joined by entanglement links; (b) the teleportation roles: Alice prepares a state, Charlie makes a Bell-state measurement, Bob applies projective measurements; (c)–(e) the silicon photonic circuits for user, relay and central nodes, with edge couplers, spiral waveguides, band-stop filters, beam splitters, phase shifters and time bins t0–t2, linked by 6.15 km fibres; (f) a photograph of the 3 mm × 16 mm chip holding all three circuits. It is Fig. 1 of Liu et al., Light: Science & Applications (2025). Qubits pass between the circuits as time-bin photons over fibre. “Fig. 1 — Fig. 1a Scenario of a star-topology quantum network. b Functions of the photonic quantum teleportation involving the user node, relay node, and central node.…” by Liu et al., www.nature.com/articles/s41377-025-01920-z, CC BY 4.0 (creativecommons.org/licenses/by/4.0/)
Fig. 1 — Fig. 1(a) Schematic of the setup for on-chip state preparation. Single photons are generated by a spontaneous parametric down-conversion (SPDC) sour…
Rendered drawing of a two-node photonic quantum network. (a) The sending node: a laser pumps a ppKTP crystal to make photon pairs, which pass filters, delay lines and a fibre array into a chip, then polarization optics (wave plates, beam splitters) to superconducting nanowire single-photon detectors (SNSPDs). (b) The chip's silicon circuit: inputs i10–i21, Mach–Zehnder interferometers with phase shifters (P11–P2V) and two outputs. (c) The receiving node with its own chip and detectors. (d) Sender chip and receiver chip joined by optical fibres. It is Fig. 1 of Zatsch et al., Scientific Reports (2025). It is a fibre link between photonic chips, not a superconducting multi-chip module. “Fig. 1 — Fig. 1(a) Schematic of the setup for on-chip state preparation. Single photons are generated by a spontaneous parametric down-conversion (SPDC) source…” by Zatsch et al., www.nature.com/articles/s41598-025-29630-x, CC BY 4.0 (creativecommons.org/licenses/by/4.0/)
ic_fibre · layer 9 Interconnect · centrality 5.2 · demonstrated · since 2025 · updated 2026-09-30

Fibre links between photonic modules

Telecom fibre carrying heralded entanglement between photonic chips and racks — priced per connector, not per metre, and with no published rate.

Verdict. Real: 99.72% chip-to-chip Bell fidelity over 42 m (PsiQuantum, 2025), the fibre span itself costing ~8 mdB. Unproven: any inter-module entanglement rate. Demote if none is published by 2028.

Key references

Λ = error-suppression factor per code-distance step; QBI = DARPA Quantum Benchmarking Initiative (Stage A concept → B R&D plan → C government V&V); G1–G7 = the report's goal classes (see Actors & economics).

Identity & lineage

Commodity telecom single-mode fibre carrying single photons or heralded entangled pairs between photonic chips, racks or modules. PsiQuantum published chip-to-chip Bell fidelity 99.72 ± 0.04% over 42 m in Omega D[169]; Aurora networks 35 chips over fibre at ~14 dB total loss D[173]. The same physics underwrites metropolitan entanglement distribution, where rates are published. Attributes: flying photons, no deterministic timing, loss-dominated error; room-temperature electro-optic interfaces, photonic-IC fibre coupling.

Physics & limits

Attenuation is not the binding term at machine scale. Forty-two metres at 0.2 dB/km is ~8 mdB, while the two fibre-to-chip transitions bracketing it cost 52 ± 12 mdB each D[169] — ~104 mdB, a fifth of a ~0.5 dB per-photon budget, spent on connectors rather than span. Modularity here is priced per interface, unlike matter-qubit links. What distance costs is time: 42 m is ~206 ns one way at group index 1.47, longer than the best 2026 feed-forward electronics, so separation eats the decision budget before the loss budget. Rate is the term no computing vendor publishes, and its exchange against loss is brutal: 0.7 coincidences/s through 66 dB of metropolitan fibre versus 132/s on the 93 km leg P[791]. At rack-scale loss the ceiling reverts to source brightness and multiplexing depth.

Engineering state of the art

table
Date Figure Who Tag
2025-01 35 chips networked over fibre, ~14 dB total loss Xanadu D[173]
2025-02 Chip-to-chip Bell fidelity 99.72 ± 0.04% over 42 m PsiQuantum D[169]
2025-02 Fibre-to-chip coupling 52 ± 12 mdB PsiQuantum D[169]
2026-06-10 Edge coupling 0.085 dB/facet, claimed a benchmark Xanadu C[172]

The 2026 benchmark claim does not survive comparison: PsiQuantum's 52 mdB is ~39% lower at the same interface a year earlier D[169]C[172]. Fidelity is past 99.7%; the missing number is throughput.

PsiQuantum's 99.72% chip-to-chip Bell fidelity has no independent replication. The ~206 ns per 42 m latency and the ~104 mdB two-interface cost are derived from published figures, not measured.

Manufacturing, materials & supply chain

No new fabrication: fibre, connectors and edge-coupled arrays are commodity telecom, with Corning fibre arrays and DISCO singulation behind Xanadu's coupling figure C[172]. The scaling variable is attachment count: every module boundary is two attachments, each a yield event and a 52 mdB loss event, so at 10³ modules packaging throughput sets the build rate; at 10⁴ bundle volume and timing calibration bind; nothing addresses 10⁶. I/O burden sits upstream, in the source and the fusion measurement. The machine falls under BIS ECCN 4A906 only if its qubit count and C-NOT error land in one of the rule's bands, from 34–99 qubits at ≤ 10⁻⁴ to any error from 2,000 qubits fact.

Role in the stack

Two photonic architectures depend on it — fusion (PsiQuantum, Quandela, QuiX) and continuous-variable/GKP (Xanadu) — to scale past one chip's mode count, contributing ~0.21 µs per 42 m to the derived clock, comparable to the whole feed-forward term. Verification: the 99.72% is a conditional Bell fidelity on heralded events, channel loss excluded D[169], so it says nothing about link efficiency, and it is single-source as of 2026-09-04.

Actors & economics

Who.
Organisation Role Country What they do Evidence
PsiQuantum developer US Highest published chip-to-chip Bell fidelity over 42 m D[169]
Xanadu developer CA 35-chip fibre-networked system; coupling benchmark D[173]
Quandela developer FR Fielded 12-qubit Lucy coupled to Joliot-Curie HPC C[792]
Corning supplier US Fibre arrays for photonic chip packaging C[172]

Money.
2025-09-10 · PsiQuantum · Series E · USD 1 B at USD 7 B · BlackRock, Temasek, Baillie Gifford · closed Cfact
2026-03-26 · Xanadu · SPAC merger · ~USD 302 M gross, ~40% below plan · Crane Harbor · closed Cfact
2026-05-21 · PsiQuantum · CHIPS letter of intent · USD 100 M · US Commerce · LOI fact

Market & supply chain. Fibre and connectors are commodity; the concentrated input is precision fibre-array attachment, where Corning and a few packaging houses set loss and throughput alike. No cost per link is public. Pays for G3/G4, G6.

IP & standards. No dated patent family specific to inter-module photonic fibre linking surfaced as of 2026-09-04; ETSI QKD standards govern the physical layer, no computing-side interconnect standard exists.

Roadmaps & track record. PsiQuantum's 99.72% is unchanged since 2025-02, its 2026 progress visible only through DARPA V&V D[169]. Xanadu marketed a coupling benchmark it does not hold C[172]. No actor has published a dated inter-module rate target — a roadmap gap, not a slipped promise.

Strategic reading. While rate stays unpublished, every photonic logical-qubit roadmap rests on an unaudited number and buyers cannot compare vendors. Whoever publishes fidelity and rate together sets the benchmark; packaging houses, not chip designers, capture the margin, since loss and yield live at the connector.

Outlook & open questions

Confirm by 2028: a vendor publishing an inter-module rate with its fidelity; demote if the field still reports fidelity alone. Best case 2029: multiplexed links close a stated rate gap at rack scale. Worst case: rate stays unmeasured. Open: is 99.72% reproducible outside PsiQuantum; does multicore fibre help inside a machine.

References
  1. [169] K. Alexander et al., “A manufacturable platform for photonic quantum computing,” Nature, vol. 641, no. 8064, pp. 876–883, Feb. 2025, doi: 10.1038/s41586-025-08820-7. D
  2. [172] Xanadu, “Xanadu sets new industry benchmark in photonic chip packaging,” PR Newswire, Jun. 10, 2026. [Online]. Available: https://www.prnewswire.com/news-releases/xanadu-sets-new-industry-benchmark-in-photonic-chip-packaging-302796562.html C
  3. [173] H. A. Rad et al., “Scaling and networking a modular photonic quantum computer,” Nature, vol. 638, no. 8052, pp. 912–919, Jan. 2025, doi: 10.1038/s41586-024-08406-9. D
  4. [791] J. Du et al., “Entanglement distribution over 155 km metropolitan fiber using a CMOS-compatible silicon chip,” arXiv:2409.17558, Sep. 2024. P
  5. [792] M. U. Rehman, “Quandela Deploys Photonic Quantum Computer Integrated with HPC System,” The Quantum Insider, Apr. 14, 2026. [Online]. Available: https://thequantuminsider.com/2026/04/14/quandela-photonic-quantum-hpc/ C