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OQC TITAN

Oxford Quantum Circuits

OQC TITAN

Oxford Quantum Circuits · superconducting circuits · PLANNED (2028) · 2000 physical qubits · access: n/a

Register profile — the machine's variant of its architecture

qubit type: multi-mode superconducting qubit (dual-rail Dimon lineage)
gate evidence: no published figure
flags: a target, not a device

Technologies by layer — the machine's cell per layer

1 Qubit carrier
Transmon · primary ▥ 🔎
multi-mode superconducting qubit of the Dimon (transmon) lineage; 2,000 lattice sites (2028)
— (Atlas gap: ∅G-dimon) · alternate ▥ TITAN card ('multi-mode qubits') ✅
roadmap names 'multi-mode qubits' for TITAN — the Dimon's multimode single-device dual rail
2 Encoding
Dual-rail (erasure) encoding · primary ▥ 🔎
dual-rail encoding of the Dimon lineage (GENESIS: 'dual-rail-encoded logical qubit'); not restated for this system
3 Gate mechanism
— undisclosed — exists, nothing published ▥ 🔎
no gate mechanism published
4 Connectivity / transport
— undisclosed — exists, nothing published ▥ 🔎
lattice topology not published
5 Control
Vertical (out-of-plane) signal delivery — VIO, coaxmon, 3D wiring · primary ◌ 🔎
OQC's out-of-plane Coaxmon control lineage; not stated for this system
6 Readout
Mid-circuit erasure check · primary ◌ 🔎
error-detected dual-rail readout (GENESIS lineage); not stated for this system
7 Code
— undisclosed — exists, nothing published ▥ TITAN card ('quantum error correction code concatenation') ✅
'quantum error correction code concatenation' named; code family not published; 200 logical qubits over 2,000 sites at 1e-6
8 Decoder
— undisclosed — exists, nothing published ▥ 🔎
no decoder published for the 1e-6, 1 MHz logical target
9 Interconnect
— undisclosed — exists, nothing published ▥ TITAN card ('wafer-level packaging') ✅
'wafer-level packaging that supports thousand-qubit scaling' named; no module or link architecture published
10 Manufacturing
Superconducting-qubit lithography (Al/AlOx/Al junctions, Nb wiring, 300 mm) · primary ▥ TITAN card ('100 mm') ✅
superconducting processor at 100 mm scale with wafer-level packaging
evidence: ✅ 4 / 11